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 OKI Semiconductor MR26V01G53L
64MWord 16Bit or 128MWord 8Bit Page Mode
FEDR26V01G53L-02-01
Issue Date: Jul. 29, 2005
P2ROM
PIN CONFIGURATION (TOP VIEW)
FEATURES
? 64M-word 16-bit / 128M-word 8-bit electrically switchable configuration ? Page size of 8-word x 16-Bit or 16-word x 8-Bit ? 3.0 V to 3.6 V power supply ? Random Access time 105 ns MAX ? Page Access time 35 ns MAX ? Operating current 100 mA MAX ? Standby current 10 mA MAX ? Input/Output TTL compatible ? Three-state output
A11 A10 A9 A8 A7 A6 A5 A4
1 2 3 4 5 6 7 8
70 CE# 69 A12 68 A13 67 A14 66 A15 65 Vcc 64 A16 63 A17 62 A18 61 A19 60 A20 59 A21 58 NC 57 NC 56 NC 55 NC 54 NC 53 GND 52 NC 51 NC 50 NC 49 NC 48 A22 47 A24 46 OE#2 45 OE#1 44 D15/A-1 43 D7 42 D14 41 D6 40 D13 39 D5 38 D12 37 D4 36 Vcc
A3 9 A2 10 A1 11 A23 12
PACKAGES
? MR26V01G53L-xxxMB 70-pin plastic SSOP (P-SSOP70-500-0.80-K-MC)
NC 13 NC 14 NC 15 NC 16 NC 17 GND 18 NC 19 NC 20 NC 21 NC 22
70SSOP
P2ROM ADVANCED TECHNOLOGY
P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers code into the P2ROM prior to final production testing. Advancements in this technology allows production costs to be equivalent to MASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following; * Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product. * No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply. * No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price. * Custom Marking is available at no additional charge
NC 23 BYTE# 24 A0 25 D0 26 D8 27 D1 28 D9 29 Vcc 30 D2 31 D10 32 D3 33 D11 34 GND 35
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FEDR26V01G53L-02-01
OKI Semiconductor
MR26V01G53L/ P2ROM
BLOCK DIAGRAM
A1
? 8 / ? 16 Switch
CE# CE
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24
OE#1 OE1
OE#2 OE2
BYTE#
Memory Cell Matrix 64M ? 16-Bit or 128M ? 8-Bit
Multiplexer
Output Buffer D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 D10 D12 D14 D15
D11
D13
In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin.
PIN DESCRIPTIONS
Pin name D15 / A1 A0 to A24 D0 to D14 CE# OE#1 OE#2 BYTE# VCC VSS NC Functions Data output / Address input Address inputs Data outputs Chip enable input Output enable input Word / Byte select input Power supply voltage Ground No connect
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FEDR26V01G53L-02-01
OKI Semiconductor
MR26V01G53L/ P2ROM
FUNCTION TABLE
Mode
(Vcc=3.0V~3.6V)
CE# OE#1
Read (16-Bit) Read (8-Bit) Output disable Standby
0000000-1FFFFFF 2000000-3FFFFFF 0000000-3FFFFFF 4000000-7FFFFFF
Address
L L L H
L H L H
OE#2
H L H L H
BYTE#
D0 to D7
H L H L H L DOUT
DOUT(MSB=0) DOUT(MSB=1) HiZ HiZ HiZ
D8 to D14
D15/A1
L/H
H
: Dont Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter Operating temperature under bias Storage temperature Input voltage Output voltage Power supply voltage Power dissipation per package Output short circuit current Symbol Ta Tstg VI VO VCC PD IOS Condition Relative to VSS Ta = 25 Value 0 to 70 55 to 125 0.5 to VCC+0.5 0.5 to V CC+0.5 0.5 to 5 1.0 10 Unit C V V V W mA
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70 )
Parameter VCC power supply voltage Input H level Input L level Symbol VCC VIH VIL Condition VCC = 3.0 to 3.6 V Min. 3.0 2.2 0.5 Typ. Max. 3.6 VCC+0.5 0.6 Unit V V V
Voltage is relative to VSS. : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.3 V, Ta = 25 , f = 1 MHz)
Parameter Input BYTE# Output Symbol CIN1 CIN2 COUT Condition VI = 0 V VO = 0 V Min. Typ. Max. 15 400 15 Unit pF
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FEDR26V01G53L-02-01
OKI Semiconductor
MR26V01G53L/ P2ROM
ELECTRICAL CHARACTERISTICS
DC Characteristics (VCC = 3.0 V to 3.6 V, Ta = 0 to 70 )
Parameter Input leakage current Output leakage current VCC power supply current (Standby) VCC power supply current (Read) Input H level Input L level Output H level Output L level Symbol ILI ILO ICCSC ICCST ICCA1 VIH VIL VOH VOL Condition VI = 0 to VCC VO = 0 to VCC CE# = VCC CE# = VIH CE# = VIL, OE# = VIH f=5MHz IOH = 1 mA IOL = 2 mA Min. 2.2 0.5 2.4 Typ. Max. 10 10 10 10 100 VCC+0.5 0.6 0.4 Unit A A mA mA mA V V V V
Voltage is relative to VSS. : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. : -1.5V(Min.) when pulse width of undershoot is less than 10ns. AC Characteristics (VCC = 3.0 V to 3.6 V, Ta = 0 to 70 )
Parameter Address cycle time Address access time Page cycle time Page access time CE# access time OE# access time OE# delay time Output disable time Output hold time Symbol tC tACC tPC tPAC tCE tOE tOES tCHZ tOHZ tOH Condition CE# = VIL OE1# or OE2#= VIL CE# = VIL OE1# or OE2#= VIL OE1# or OE2#= VIL CE# = VIL OE1# or OE2#= VIL CE# = VIL CE# = VIL OE1# or OE2#= VIL Min. 105 35 0 0 0 0 Max. 105 35 105 30 20 20 Unit ns ns ns ns ns ns ns ns ns ns
Measurement conditions Input signal level ---------------------------------- 0 V/3 V Input timing reference level --------------------- 1/2Vcc Output load ----------------------------------------- 50 pF Output timing reference level ------------------- 1/2Vcc Output load
Output 50 pF (Including scope and jig)
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FEDR26V01G53L-02-01
OKI Semiconductor
MR26V01G53L/ P2ROM
TIMING CHART (READ CYCLE)
Random Access Mode Read Cycle
tC Address tCE CE# tOE tOH tCHZ tACC tOH tC
OE#1or OE#2
OE#2or OE#1 TOES tACC Dout Hi-Z Valid Data tOHZ Valid Data Hi-Z
Page Access Mode Read Cycle
tC A3 to A24 tPC A-1 to A2 (Byte mode) A0 to A2 (Word mode) tCE tOH tPC
CE# tOE OE#1 or OE#2 tCHZ
OE#2 or OE#1 TOES Dout tACC Hi-Z tPAC
Valid Data
tPAC
Valid Data Valid Data
tOHZ Hi-Z
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FEDR26V01G53L-02-01
OKI Semiconductor
MR26V01G53L/ P2ROM
PACKAGE DIMENSIONS
(Unit: mm)
oIINeoeooeoOoOY
5
Notes for Mounting the Surface Mount Type Package
1/2 (R)* O1/4 (R) (R)* * (R) 1/2 (c)* o/ Io OonO- I*-1/4
U (R)-* ii I1/4(R) * o ek/ ioie ICo inOo iio ii
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Okis responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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FEDR26V01G53L-02-01
OKI Semiconductor
MR26V01G53L/ P2ROM
REVISION HISTORY
Page Date Previous Edition Current Edition Final edition 1 Description
Document No. FEDR26V01G53L-02-01
Jul. 29, 2005
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FEDR26V01G53L-02-01
OKI Semiconductor
MR26V01G53L/ P2ROM
NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third partys industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third partys right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2005 Oki Electric Industry Co., Ltd.
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